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dc.contributor.authorGrande, Pedro Luispt_BR
dc.contributor.authorVos, Maartenpt_BR
dc.contributor.authorVenkatachalam, Dinesh K.pt_BR
dc.contributor.authorNandi, Sanjoy K.pt_BR
dc.contributor.authorElliman, R. G.pt_BR
dc.date.accessioned2016-06-09T02:08:31Zpt_BR
dc.date.issued2013pt_BR
dc.identifier.issn0003-6951pt_BR
dc.identifier.urihttp://hdl.handle.net/10183/142390pt_BR
dc.description.abstractWe demonstrate the application of high-energy elastic electron backscattering to the analysis of thin (2–20 nm) HfO2 overlayers on oxidized Si substrates. The film composition and thickness are determined directly from elastic scattering peaks characteristic of each element. The stoichiometry of the films is determined with an accuracy of 5%–10%. The experimental results are corroborated by medium energy ions scattering and Rutherford backscattering spectrometry measurements, and clearly demonstrate the applicability of the technique for thin-film analysis. Significantly, the presented technique opens new possibilities for nm depth profiling with high spatial resolution in scanning electron microscopes.en
dc.format.mimetypeapplication/pdfpt_BR
dc.language.isoengpt_BR
dc.relation.ispartofApplied physics letters. New York. Vol. 103, no. 7 (Aug. 2013), 071911, 4 p.pt_BR
dc.rightsOpen Accessen
dc.subjectEstequiometriapt_BR
dc.subjectMicroscopia eletrônicapt_BR
dc.subjectRetroespalhamento rutherfordpt_BR
dc.subjectCompostos de háfniopt_BR
dc.titleDetermination of thickness and composition of high-k dielectrics using high-energy electronspt_BR
dc.typeArtigo de periódicopt_BR
dc.identifier.nrb000903739pt_BR
dc.type.originEstrangeiropt_BR


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