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dc.contributor.authorSouza, Joel Pereira dept_BR
dc.contributor.authorCharry, E.pt_BR
dc.date.accessioned2011-02-15T05:59:08Zpt_BR
dc.date.issued1981pt_BR
dc.identifier.issn0018-9383pt_BR
dc.identifier.urihttp://hdl.handle.net/10183/27820pt_BR
dc.description.abstractThis paper reports on the threshold adjustment of NMOS transistors by arsenic ion implantation in the channel region directly into bare silicon just before the gate oxidation. Experimental results showed very good uniformity and reproducibility of the threshold voltages, low body effect, and high mobility values.en
dc.format.mimetypeapplication/pdfpt_BR
dc.language.isoengpt_BR
dc.relation.ispartofIEEE Transactions on Electron Devices. New York. Vol. 28, no. 10 (Oct. 1981), p. 1176-1178pt_BR
dc.rightsOpen Accessen
dc.subjectFísica da matéria condensadapt_BR
dc.subjectImplantação de íonspt_BR
dc.subjectOxidacao : Siliciopt_BR
dc.titleThreshold shifting of nmos transitions by arsenic ion implantation prior to gate oxidationpt_BR
dc.typeArtigo de periódicopt_BR
dc.identifier.nrb000143333pt_BR
dc.type.originEstrangeiropt_BR


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