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dc.contributor.authorZhao, Fupt_BR
dc.contributor.authorXu, Yinpt_BR
dc.contributor.authorTumelero, Milton Andrépt_BR
dc.contributor.authorPelegrini, Silviapt_BR
dc.contributor.authorPasa, Andre Avelinopt_BR
dc.contributor.authorZangari, Giovannipt_BR
dc.date.accessioned2019-05-15T02:37:51Zpt_BR
dc.date.issued2018pt_BR
dc.identifier.issn0013-4651pt_BR
dc.identifier.urihttp://hdl.handle.net/10183/194241pt_BR
dc.description.abstractIntegrated circuits currently use mainly copper as the interconnect material; unfortunately the ongoing miniaturization currently requires materials with higher electromigration resistance and possibly improved conductivity. In this context we report on the structure, microstructure and electrical properties of a series of Cu-Ge(O) alloy films, electrodeposited from an alkaline tartrate electrolyte. The composition of the films varies between zero and 20 at% Ge, with a significant incorporation of oxygen. Film morphology is dense and uniform, with Cu-Ge films exhibiting smaller apparent grain size (~50 nm) with respect to Cu films grown from a similar electrolyte. Solid solutions and phase mixtures of a solid solution with the intermetallic are observed with increasing Ge fraction; the presence of intermetallic phases is confirmed by TEM imaging and diffraction. The resistivity of 50 nm thick films follows the published trend, with a slight increase of the value upon solid solution formation and a minimum in correspondence of the intermetallic composition. Thicker films (~1 um) on the other hand show a different trend, with resistivity increasing with Ge and O at%; in this case the resistivity is probably dominated by the oxygen incorporation.en
dc.format.mimetypeapplication/pdfpt_BR
dc.language.isoengpt_BR
dc.relation.ispartofJournal of the Electrochemical Society. Hooksett. Vol. 165, no. 13 (Oct. 2018), p. D628-D634pt_BR
dc.rightsOpen Accessen
dc.subjectCondutividade elétricapt_BR
dc.subjectEletrodeposiçãopt_BR
dc.subjectFilmes finospt_BR
dc.subjectLigas de cobrept_BR
dc.titleElectrical conductivity in electrodeposited Cu-Ge(O) alloy filmspt_BR
dc.typeArtigo de periódicopt_BR
dc.identifier.nrb001085144pt_BR
dc.type.originEstrangeiropt_BR


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